Curable resin composition, semiconductor encapsulation material, adhesive, adhesive film, prepreg, interlayer insulating material, and printed-wiring board

Abstract

Provided is a resin composition capable of being turned into a cured product exhibiting excellent dielectric properties even at high frequencies and small changes in dielectric properties even after being left under a high temperature for a long period. The resin composition is a curable resin composition containing: (A) a maleimide compound represented by the following general formula (1) wherein D independently represents a dimer acid- and trimer acid-derived hydrocarbon group; B independently represents a cyclic structure-containing divalent hydrocarbon group other than a dimer acid- and trimer acid-derived hydrocarbon group; A independently represents a tetravalent organic group having a cyclic structure; m is 0 to 100, n is 0 to 100; and (B) a catalyst, wherein D in the formula (1) is a group in which dimer acid-derived hydrocarbon group occupies 95% by mass or more of the dimer acid- and trimer acid-derived hydrocarbon group, and is a hydrogenated group.

Dependencies are inferred from the claim text.