Polishing apparatus for a substrate and polishing method for a substrate using the same

A polishing apparatus for a substrate, comprising:

• a polishing pad having at least one region formed of a light-transmitting material;
• a platen on which the polishing pad is disposed on an upper surface thereof, the platen having a groove portion in a region overlapping the polishing pad, and being rotatably installed in one direction;
• a light source unit accommodated in the groove portion of the platen, and configured to emit light of a predetermined wavelength band to the one region of the polishing pad;
• a slurry supply unit configured to supply a slurry containing photocatalyst particles excited by the light of the predetermined wavelength band to the polishing pad;
• and
• a polishing head installed on the polishing pad to be spaced apart from the slurry supply unit in the one direction, and configured to rotate the substrate in contact with the polishing pad.

A polishing apparatus for a substrate, comprising:

• a platen on which a polishing pad formed of a light-transmitting material is disposed on an upper surface thereof, and rotatably installed in one direction;
• a light source unit accommodated in a groove portion formed on an upper surface of the platen, and configured to emit light of a predetermined wavelength band toward the polishing pad;
• and
• a slurry supply unit configured to supply a slurry containing photocatalyst particles excited by the light of the predetermined wavelength band to the polishing pad.