Processing apparatus and processing method

Abstract

There is provided a processing apparatus which processes a workpiece. The processing apparatus includes a processing mechanism having a holding unit which holds the workpiece, and a processing unit which processes the workpiece held by the holding unit, a first cleaning mechanism having a spinner table on which the workpiece processed by the processing unit is held, and a cleaning fluid nozzle which supplies a cleaning fluid containing water to clean the workpiece held on the spinner table, and a second cleaning mechanism including a cleaning holding unit which holds the workpiece cleaned by the first cleaning mechanism, a polishing cleaning liquid supply unit which supplies a polishing cleaning liquid to the workpiece held by the cleaning holding unit, and a polishing pad which abuts on the workpiece supplied with the polishing cleaning liquid to polish the workpiece, thereby cleaning the workpiece.

Dependencies are inferred from the claim text.