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US 2023/0413500 A1Published application
Metallic based electromagnetic interference shielding materials, devices, and methods of manufacture thereof
AssigneeNanotech Energy, Inc.
InventorsMaher F. EL-KADY, Jack KAVANAUGH, Richard B. KANER, Scott LAINE
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Abstract
Described are EMI shields comprising a substrate, a metal-based conductive additive, and a binder incorporated with the conductive additive and deposited on the substrate, and methods of making thereof. In some embodiments, a carbon-based additive is included to enhance the mechanical properties and/or conductivity of the EMI shield.
Claims47
An EMI shield comprising:
- a) a substrate;
- b) a metal-based conductive additive;
- and
- c) a binder incorporated with the metal-based conductive additive and deposited as an EMI shielding coating on the substrate.
1 more element
AN EMI shielding coating comprising:
- a) a metal-based conductive additive;
- b) a binder;
- and
- c) a solvent incorporated with the metal-based conductive additive and binder to form the EMI shielding coating.
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A method of forming an EMI shield comprising:
- a) forming a coating comprising a metal-based conductive additive, a binder, and a solvent;
- b) depositing the coating on a substrate;
- and
- c) drying the coating on the substrate to form an EMI shielding coating.
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Dependencies are inferred from the claim text.