Circuit board and method for manufacturing same, and electronic device comprising same circuit board

An electronic device comprising:

• a circuit board;
• a connecting conductor bonded to the circuit board using a conductive bonding material;
• and
• a device installed apart from the circuit board,
• wherein the circuit board includes a base layer, a wiring layer formed on the base layer, and a terminal section formed at a level corresponding to the wiring layer, on a first surface and a side surface of one end portion of the base layer.

A method of fabricating a circuit bord, comprising:

• once a circuit board, including a base layer, a first wiring layer, and an insulating layer, is prepared, forming a through hole in an outer region of the insulating layer;
• forming a metal film and plating resist on both surfaces of the circuit board;
• performing exposure and development on the circuit board;
• and
• forming a second wiring layer and a terminal section on a top surface and a side surface of the insulating layer.