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US 2023/0413452 A1Published application
Laminated wiring board
AssigneeShinko Electric Industries Co., Ltd.
InventorShota MIKI
Life of this patent
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Abstract
A laminated wiring board includes a plurality of first wiring boards laminated on one another, a first insulating resin layer disposed between two adjacent first wiring boards among the plurality of first wiring boards, and a second insulating resin layer configured to cover side surfaces of the plurality of first wiring boards.
Claims9
A laminated wiring board comprising:
- a plurality of first wiring boards laminated on one another;
- a first insulating resin layer disposed between two adjacent first wiring boards among the plurality of first wiring boards;
- and
- a second insulating resin layer configured to cover side surfaces of the plurality of first wiring boards.
1 more element
Dependencies are inferred from the claim text.