Assembling method of electronic module
AssigneeDelta Electronics, Inc.
InventorsKun Jiang, Xi Liu, Xiaodong Chen
Life of this patent
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Abstract
An assembling method of an electronic module is disclosed and includes steps of: (a) providing a first circuit board including a first side and a second side; (b) providing a second circuit board including a third side and a fourth side, and a connection component connected to the third side; (c) providing a solder ball, and stacking the first circuit board, the second circuit board and the solder ball; and (d) performing a reflow soldering process to a stacked structure of the first circuit board, the second circuit board and the solder ball.
Claims20
An assembling method of an electronic module, comprising steps of:
- (a) providing a first circuit board including a first side and a second side;
- (b) providing a second circuit board including a third side, a fourth side and a connection component, wherein one end of the connection component is connected to the third side through a first reflow soldering process;
- (c) providing a solder ball, and stacking the first circuit board, the second circuit board and the solder ball;
- and
- (d) performing a second reflow soldering process to a stacked structure of the first circuit board, the second circuit board and the solder ball.
An assembling method of an electronic module, comprising steps of:
- (a) providing a first circuit board including a first side and a second side;
- (b) providing a second circuit board including a third side, a fourth side and a connection component, wherein one end of the connection component is connected to the third side;
- (c) providing a solder ball, and stacking the first circuit board, the second circuit board and the solder ball;
- and
- (d) performing a reflow soldering process to a stacked structure of the first circuit board, the second circuit board and the solder ball.
Dependencies are inferred from the claim text.