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US 2023/0413425 A1Published application
Circuit board
AssigneeLG Innotek Co., Ltd.
InventorsMyung Jae KWON, Dong Sun KIM, Sang Hyuck NAM, Sung Wuk RYU, Chang Woo YOO, Ju Hyun LEE
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Abstract
A circuit board according to an embodiment includes a first insulating layer including a first region and a second region; and a first circuit pattern layer disposed on the first insulating layer; wherein the first circuit pattern layer includes a first electrode disposed on the first region of the first insulating layer and including a first opening, and wherein the first opening pass through upper and lower surfaces of the first electrode.
Claims19
1-10. (canceled)
A circuit board comprising:
- a first insulating layer;
- and
- a second insulating layer disposed on the first insulating layer,
- wherein the first insulating layer includes a first opening passing through at least a part of the first insulating layer from an upper surface of the first insulating layer toward a lower surface of the first insulating layer, and
- wherein the second insulating layer is provided to fill the first opening of the first insulating layer.
2 more elements
Dependencies are inferred from the claim text.