Antenna module, semiconductor device and methods for making the same
AssigneeSTATS ChipPAC Pte. Ltd.
InventorsHunTeak LEE, SangHo SONG, YeonJee LEE
Life of this patent
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Abstract
An antenna module comprises: an antenna body comprising a first surface for attaching the antenna module to an external substrate, and a second surface through which the antenna module transmits and receives electromagnetic signals, wherein the first surface is opposite to the second surface; an antenna conductive pattern formed within the antenna body; and a shielding fence laterally surrounding the antenna conductive pattern for shielding electromagnetic interferences.
Claims20
An antenna module comprising:
- an antenna body comprising a first surface for attaching the antenna module to an external substrate, and a second surface through which the antenna module transmits and receives electromagnetic signals, wherein the first surface is opposite to the second surface;
- an antenna conductive pattern formed within the antenna body;
- and
- a shielding fence laterally surrounding the antenna conductive pattern for shielding electromagnetic interferences.
A semiconductor device, comprising:
- a substrate comprising a first surface, a second surface opposite to the first surface, and substrate conductive patterns that extend between the first surface and the second surface;
- an antenna module attached on the first surface of the substrate, the antenna module comprising:
- an antenna body,
- an antenna conductive pattern formed within the antenna body, and
- a shielding fence laterally surrounding the antenna conductive pattern for shielding electromagnetic interferences;
- a first electronic component attached on the first surface of the substrate and besides the antenna module;
- a second electronic component attached on the second surface of the substrate, wherein the second electronic component is coupled to the first electronic component and the antenna module through at least two of the substrate conductive patterns;
- and
- a shielding layer formed on the second electronic component for shielding electronic interferences.
A method for making a semiconductor device, comprising:
- providing a substrate comprising a first surface, a second surface opposite to the first surface and substrate conductive patterns that extend between the first surface and the second surface;
- attaching a first electronic component on the first surface of the substrate;
- attaching an antenna module on the first surface of the substrate and besides the first electronic component, the antenna module comprising:
- an antenna body, an antenna conductive pattern formed within the antenna body, and a shielding fence laterally surrounding the antenna conductive pattern for shielding electromagnetic interferences;
- attaching a second electronic component on the second surface of the substrate, wherein the second electronic component is coupled to the first electronic component and the antenna module through at least two of the substrate conductive patterns;
- and
- forming a shielding layer on the second electronic component for shielding electronic interferences.
Dependencies are inferred from the claim text.