Electronic device and method for manufacturing the same
AssigneeInnolux Corporation
InventorsZhi-Wei ZHANG, Hua-Pin CHEN, Shuai WANG, Chien-Hao KUO
Life of this patent
Estimating the term…
Abstract
An electronic device and a method for manufacturing the same are provided. The electronic device includes: a substrate; an electronic component disposed on the substrate; a first optical component disposed on the substrate and the electronic component; and a first optical adhesive disposed between the substrate and the first optical component to bond the substrate and the first optical component, wherein a Young's modulus of the first optical adhesive ranges between 10 kPa and 150 kPa.
Claims20
An electronic device, comprising:
- a substrate;
- an electronic component disposed on the substrate;
- a first optical component disposed on the substrate and the electronic component;
- and
- a first optical adhesive disposed between the substrate and the first optical component to bond the substrate and the first optical component,
- wherein a Young's modulus of the first optical adhesive ranges between 10 kPa and 150 kPa.
A method for manufacturing an electronic device, comprising the following steps:
- providing a substrate;
- disposing an electronic component on the substrate;
- and
- adhering a first optical adhesive on the substrate and the electronic component and performing a vacuuming step, wherein a temperature of the vacuuming step ranges between 10° C. and 70° C.
An electronic device, comprising:
- a substrate;
- an electronic component disposed on the substrate;
- a reflective structure disposed on the substrate and adjacent to the electronic component;
- a first optical component disposed on the substrate and the electronic component;
- and
- a first optical adhesive disposed between the substrate and the first optical component to bond the substrate and the first optical component,
- wherein there is a gap between the reflective structure and the electronic component, and the gap ranges between 0.05 mm and 0.25 mm.
Dependencies are inferred from the claim text.