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US 2023/0411459 A1Published application
Diamond Wafer Based Electronic Vehicle Power Electronics
AssigneeDiamond Foundry Inc.
InventorJEAN-CLAUDE HAREL
Life of this patent
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Abstract
A power device electronics system includes a thermal management configuration in which a power electronics chip is attached to a copper substrate and a single crystal diamond substrate attached to the copper substrate. The copper substrate is sandwiched between a first side of the diamond substrate and the power electronics chip.
Claims34
A power device, comprising:
- a first power electronics chip attached to a first copper substrate;
- and
- a first diamond substrate attached to the first copper substrate, wherein the first copper substrate is sandwiched between a first side of the first diamond substrate and the first power electronics chip.
A powered vehicle system comprising:
- at least one half bridge device having a power electronics chip mounted to a copper substrate and the copper substrate sandwiched between the power electronics chip and a diamond substrate;
- and
- a motor conductively coupled to the at least one half bridge device.
Dependencies are inferred from the claim text.