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US 2023/0411436 A1Published application
Chip-scale package light emitting diode
AssigneeSeoul Viosys Co., Ltd.
InventorsSe Hee OH, Jong Kyu Kim, Joon Sub Lee
Life of this patent
Estimating the term…
Abstract
A chip-scale package type light emitting diode is provided. In the light emitting diode according to one embodiment, an opening exposing a pad metal layer is separated from an opening of a lower insulation layer which exposes an ohmic reflection layer formed on a mesa. Therefore, it is possible to prevent solder, particularly Sn, from diffusing and contaminating the ohmic reflection layer.
Claims21
(canceled)
A light apparatus, comprising:
- a substrate including a conductive pattern;
- a light source disposed on the substrate and electrically connected to the conductive pattern, the light source including:
- a first conductivity type semiconductor layer;
- a mesa disposed on the first conductivity type semiconductor layer, the mesa comprising an active layer and a second conductivity type semiconductor layer;
- an ohmic layer disposed on the mesa and electrically connected to the second conductivity type semiconductor layer;
- a lower insulation layer disposed on the ohmic layer and includes first material and second material;
- a preliminary layer is disposed between the ohmic layer and the lower insulation layer;
- a first pad metal layer disposed on the lower insulation layer and electrically connected to the first conductivity type semiconductor layer;
- a second pad metal layer disposed on the lower insulation layer, and electrically connected to the ohmic layer;
- an upper insulation layer covering the first pad metal layer and the second pad metal layer, the upper insulation layer comprising a first opening configured to expose the first pad metal layer and a second opening configured to expose the second pad metal layer;
- a first bump pad connected to the first pad metal layer through the first opening of the upper insulation layer;
- and
- a second bump pad connected to the second pad metal layer through the second opening of the upper insulation layer;
- and
- a light transmissive layer disposed on the light source,
- wherein the lower insulation layer has plurality of refractive indices and, and the upper insulation layer cover a side surface of the preliminary layer and the first material of the lower insulation layer.
13 more elements
A light apparatus, comprising:
- a substrate including a conductive pattern;
- a light source disposed on the substrate and electrically connected to the conductive pattern, the light source including:
- a first conductivity type semiconductor layer;
- a mesa disposed on the first conductivity type semiconductor layer, the mesa comprising an active layer and a second conductivity type semiconductor layer;
- an ohmic layer disposed on the mesa and electrically connected to the second conductivity type semiconductor layer;
- a lower insulation layer disposed on the ohmic layer;
- a preliminary layer is disposed between the ohmic layer and the lower insulation layer;
- a first pad metal layer disposed on the lower insulation layer and electrically connected to the first conductivity type semiconductor layer;
- a second pad metal layer disposed on the lower insulation layer, and electrically connected to the ohmic layer;
- an upper insulation layer covering the first pad metal layer and the second pad metal layer, the upper insulation layer comprising a first opening configured to expose the first pad metal layer and a second opening configured to expose the second pad metal layer;
- a first bump pad connected to the first pad metal layer through the first opening of the upper insulation layer;
- and
- a second bump pad connected to the second pad metal layer through the second opening of the upper insulation layer;
- and
- a light transmissive layer disposed on the light source,
- wherein the lower insulation layer includes first material and second material, and the preliminary layer and upper insulation layer include material same with the first material.
13 more elements
A light apparatus, comprising:
- a substrate including a conductive pattern;
- a light source disposed on the substrate and electrically connected to the conductive pattern, the light source including:
- a first conductivity type semiconductor layer;
- a mesa disposed on the first conductivity type semiconductor layer, the mesa comprising an active layer and a second conductivity type semiconductor layer;
- an ohmic layer disposed on the mesa and electrically connected to the second conductivity type semiconductor layer;
- a lower insulation layer disposed on the ohmic layer and includes first material and second material;
- a preliminary layer is disposed between the ohmic layer and the lower insulation layer;
- a first pad metal layer disposed on the lower insulation layer and electrically connected to the first conductivity type semiconductor layer;
- a second pad metal layer disposed on the lower insulation layer, and electrically connected to the ohmic layer;
- an upper insulation layer covering the first pad metal layer and the second pad metal layer, the upper insulation layer comprising a first opening configured to expose the first pad metal layer and a second opening configured to expose the second pad metal layer;
- a first bump pad connected to the first pad metal layer through the first opening of the upper insulation layer;
- and
- a second bump pad connected to the second pad metal layer through the second opening of the upper insulation layer;
- and
- a light transmissive layer disposed on the light source;
- wherein the lower insulation layer has reflectivity and plurality of refractive indices and, and the preliminary layer and the upper insulation layer include material same with the first material.
13 more elements
Dependencies are inferred from the claim text.