Rf circuit module and manufacturing method therefor

A manufacturing method for an RF circuit module including a module substrate having electrodes for mounting components, a first substrate in which a first circuit including a control circuit is implemented, and a second substrate in which a second circuit including a radio-frequency amplifier circuit controlled by the control circuit is implemented, the manufacturing method comprising:

• forming the first circuit and a substrate-to-substrate connection conductor in an elemental semiconductor substrate that is the first substrate;
• forming a semiconductor thin film on a compound semiconductor substrate via a release layer, the semiconductor thin film having the second circuit and a substrate-to-substrate connection conductor, the semiconductor thin film being the second substrate;
• implementing the second substrate by removing the release layer through etching to release the semiconductor thin film from the compound semiconductor substrate;
• implementing a laminated body made up of the first substrate and the second substrate by bonding the second substrate at a predetermined position of the first substrate to connect the substrate-to-substrate connection conductor of the first substrate and the substrate-to-substrate connection conductor of the second substrate;
• forming a first substrate-side conductor protrusion connected to the first circuit and a second substrate-side conductor protrusion connected to the second circuit;
• and
• mounting the laminated body on the module substrate by connecting the first substrate-side conductor protrusion and the second substrate-side conductor protrusion to the electrodes of the module substrate.