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US 2023/0411340 A1Published application
Semiconductor device including embedded memory dies and method of making same
AssigneeWestern Digital Technologies, Inc.
InventorsLee Kong Yu, Yoong Tatt Chin, Kim Lee Bock, Paramjeet Gill, Wei Chiat Teng, Chong Un Tan
Life of this patent
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Abstract
A semiconductor device includes a signal carrier medium such as a PCB substrate having first and second opposed surfaces and a cavity formed in the second surface. A first set of one or more semiconductor dies are mounted on the first surface, and a second set of one or more semiconductor dies are mounted within the cavity. The first and/or second sets of semiconductor dies may be memory dies.
Claims20
A semiconductor device, comprising:
- a signal carrier medium including first and second opposed surfaces;
- a first group of contact pads on the first surface of the signal carrier medium;
- a cavity formed in the second surface of the signal carrier medium;
- a second group of contact pads within the cavity;
- a first group of one or more semiconductor dies mounted on the first surface of the signal carrier medium and electrically coupled to the first group of contact pads on the first surface of the signal carrier medium;
- and
- a second group of semiconductor dies mounted in the cavity and electrically coupled to the second group of contact pads within the cavity, the second group of semiconductor dies comprising two or more memory dies stacked on each other.
4 more elements
A semiconductor device, comprising:
- a signal carrier medium including first and second opposed surfaces;
- a first conductive layer on the first surface comprising a first set of traces and contact pads;
- a second conductive layer between the first and second surfaces comprising a second set of traces and contact pads;
- a third conductive layer on the second surface comprising a third set of traces and contact pads;
- a cavity formed in the second surface of the signal carrier medium to a depth exposing the second conductive layer;
- a first plurality of memory dies mounted on the first surface of the signal carrier medium and physically coupled to the contact pads of the first set of traces and contact pads;
- and
- a second plurality of stacked memory dies mounted in the cavity and physically coupled to the contact pads of the second set of traces and contact pads.
5 more elements
A semiconductor device, comprising:
- a signal carrier means including first and second opposed surfaces;
- a first conductive layer on the first surface comprising a first set of traces and contact pads;
- a second conductive layer between the first and second surfaces comprising a second set of traces and contact pads;
- a third conductive layer on the second surface comprising a third set of traces and contact pads;
- means for exposing the contact pads of the second set of traces and contact pads to enable wire bonding to the contact pads of the second set of traces and contact pads;
- a first plurality of memory dies mounted on the first surface of the signal carrier medium and wire bonded to the contact pads of the first set of traces and contact pads;
- and
- a second plurality of memory dies mounted in the cavity and wire bonded to the contact pads of the second set of traces and contact pads.
5 more elements
Dependencies are inferred from the claim text.