Semiconductor device
AssigneeKioxia Corporation
InventorsShinya ARAI, Yuta TAGUCHI
Life of this patent
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Abstract
According to an embodiment, a semiconductor device includes a first chip including a substrate, and a second chip bonded to the first chip at a first surface. Each of the first chip and the second chip includes an element region, and an end region including a chip end portion. The first chip includes a plurality of first electrodes that are arranged on the first surface in the end region and are in an electrically uncoupled state. The second chip includes a plurality of second electrodes that are arranged on the first surface in the end region, are in an electrically uncoupled state, and are respectively in contact with the first electrodes.
Claims20
A semiconductor device comprising:
- a first chip including a substrate;
- and
- a second chip bonded to the first chip at a first surface,
- wherein
- each of the first chip and the second chip includes an element region, and an end region including a chip end portion,
- the first chip includes a plurality of first electrodes that are arranged on the first surface in the end region and are in an electrically uncoupled state, and
- the second chip includes a plurality of second electrodes that are arranged on the first surface in the end region, are in an electrically uncoupled state, and are respectively in contact with the first electrodes.
A semiconductor device comprising:
- a first chip including a substrate;
- and
- a second chip bonded to the first chip at a first surface,
- wherein
- each of the first chip and the second chip includes an element region including a first region and a second region surrounding the first region, and a third region surrounding the element region,
- the first surface in the second region is provided with a fourth region and a fifth region,
- the first chip further includes:
- a plurality of first electrodes that are arranged in the fourth region and are electrically coupled to the substrate;
- and
- a plurality of first dummy electrodes arranged in the fifth region in an electrically uncoupled state,
- the second chip further includes:
- a plurality of second electrodes that are arranged in the fourth region, are electrically coupled to an external connection terminal, and are respectively in contact with the first electrodes;
- and
- a plurality of second dummy electrodes that are arranged in the fifth region in an electrically uncoupled state, and are respectively in contact with the first dummy electrodes, and
- the first electrodes occupy an area of the fourth region at a first ratio and the first dummy electrodes occupy an area of the fifth region at a second ratio, the first ratio and the second ratio differing by 5% or less.
Dependencies are inferred from the claim text.