Semiconductor device and semiconductor storage device
OwnerMasayoshi TAGAMIinventor
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OwnerMasayoshi TAGAMIinventor
Estimating the term…
According to one embodiment, a semiconductor device includes a first chip with a first electrode and a second electrode and a second chip with a third electrode and a fourth electrode. The first and second chips are bonded to each other with the first electrode contacting the third electrode and the second electrode contacting the fourth electrode. A thickness of the first electrode in a first direction perpendicular to a bonding interface between the first chip and the second chip is less than a thickness of the second electrode in the first direction. A planar area of the first electrode at the bonding interface is greater than a planar area of the second electrode at the bonding interface.
A semiconductor device, comprising:
A semiconductor storage device, comprising:
Dependencies are inferred from the claim text.