Semiconductor device including a dummy power pad and a pad placement method thereof

A semiconductor device, comprising:

• a core logic unit configured to receive a power and configured to receive and process an input signal to generate an output signal;
• signal pads configured to transmit the input signal to the core logic unit or output the output signal from the core logic unit to an outside of the semiconductor device;
• a power/ground pad configured to transfer the power provided from a power rail to the core logic unit;
• and
• a dummy power/ground pad disposed at a position of a filler pad, wherein the dummy power/ground pad does not function exchange the power, the input signal, and the output signal with the core logic unit.

A method of disposing pads for transmitting a power or a signal to an internal circuit of a semiconductor device, the method comprising:

• disposing power pads, ground pads, and signal pads in a die edge region of the semiconductor device;
• detecting positions of filler pads formed between the signal pads;
• and
• disposing a dummy power pad or a dummy ground pad at the positions of the filler pads,
• wherein the dummy power pad or the dummy ground pad includes a clamp circuit for electrostatic discharge protection.