US 2023/0411273 A1 · SEMICONDUCTOR DEVICE

Abstract

A semiconductor device includes a semiconductor substrate, a first electroconductive member that is formed on the semiconductor substrate and that has a first linear portion extending along a principal surface of the semiconductor substrate, and an organic insulation layer that is formed on the semiconductor substrate and that covers the first electroconductive member, and the first linear portion includes a first side edge portion formed by a curve that is alternately bent to one side and to an opposite side of a direction intersecting a longitudinal direction of the first linear portion in a plan view.

Claims12

Dependent claims

A semiconductor device comprising:

a semiconductor substrate;
a first electroconductive member that is formed on the semiconductor substrate and that has a first linear portion extending along a principal surface of the semiconductor substrate;
and
an organic insulation layer that is formed on the semiconductor substrate and that covers the first electroconductive member,
wherein the first linear portion includes a first side edge portion formed by a curve that is alternately bent to one side and to an opposite side in a direction intersecting a longitudinal direction of the first linear portion in a plan view.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

18/458,804Filed 30 Aug 2023

Priority

JP 2021-04363317 Mar 2021

Published

21 Dec 2023

Term ends

Not estimatedThe source records don’t support an estimate.

Classification8 codes

H10W 70/65
Characterised by their interconnections: shapes or dispositions of interconnections
H10W 72/90
Interconnections or connectors in packages: bond pads, in general
H10W 70/69
Characterised by their insulating layers or insulating parts: insulating materials thereof
H10W 72/59
Bond wires: bond pads specially adapted therefor

Semiconductor device

Life of this patent

Semiconductor device

Life of this patent

Abstract

Claims12