Electronic device and manufacturing method thereof

Abstract

An electronic device including a chip, an element structure layer, a redistribution structure layer and a protective layer is provided. The chip has an active surface and a plurality of contacts disposed on the active surface. The element structure layer is disposed adjacent to the active surface and has a switch element. The switch element is electrically connected to the chip through at least one of the plurality of contacts. The redistribution structure layer is disposed adjacent to the active surface and is electrically connected to the chip through at least one of the plurality of contacts. The protective layer includes a first portion and a second portion. The first portion surrounds the chip, and the second portion surrounds the element structure layer and the redistribution structure layer. A manufacturing method of an electronic device is also provided.

Dependencies are inferred from the claim text.