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US 2023/0411271 A1Published application
Integrated circuit packages
AssigneeSTMicroelectronics (Grenoble 2) SAS
InventorsLuc PETIT, Jerome LOPEZ, Karine SAXOD
Life of this patent
Estimating the term…
Abstract
An electronic device includes an electronic chip located between a cover and an interconnection substrate. The electronic chip has contact pads located in front of a first surface of the interconnection substrate. At least one metal region (for example extending on the front surface) thermally couples at least one contact pad of the electronic chip to the cover.
Claims21
An electronic device, comprising:
- an interconnection substrate;
- an electronic integrated circuit chip mounted to the interconnection substrate;
- a cover;
- wherein the electronic chip is located between the cover and the interconnection substrate;
- wherein the electronic chip comprises contact pads located in front of a first surface of the interconnection substrate to which the electronic chip is mounted;
- and
- at least one metal region extending on the first surface of the interconnection substrate and configured to thermally couple at least one contact pad of the electronic chip to the cover.
4 more elements
An electronic device, comprising:
- an interconnection substrate having a rectangular front surface with four corners;
- an electronic integrated circuit chip having a first surface with a plurality of contact pads;
- wherein said electronic circuit chip is mounted to the interconnection substrate with the first surface of the electronic integrated circuit chip facing the rectangular front surface of the interconnection substrate;
- a metal region extending on said rectangular front surface of the interconnection substrate from one pad of the plurality of contact pads to one corner of said four corners of the rectangular front surface of the interconnection substrate;
- and
- a thermally dissipating cover having a rectangular shape conforming to the rectangular front surface of the interconnection substrate;
- wherein said thermally dissipating cover is mounted to the rectangular front surface of the interconnection substrate with the thermally dissipating cover thermally coupled to the metal region at said one corner.
4 more elements
Dependencies are inferred from the claim text.