Wiring board, semiconductor device, and method for manufacturing semiconductor device

A semiconductor device, comprising:

• a wiring board with a conductive layer on a first surface and an insulating layer covering a portion of the conductive layer, the conductive layer including:
• a first connection portion exposed from the insulating layer and having a first wettability to solder;
• a lead-out portion connected to the first connection portion and exposed from the insulating layer and having a second wettability to solder;
• and
• a wiring portion connected to the first connection portion via the lead-out portion and covered with the insulating layer;
• and
• a first semiconductor element with a first electrode soldered to the first connection portion.

A method for manufacturing a semiconductor device comprising:

• forming a conductive layer on a first surface of a wiring board, the conductive layer having copper as a main component;
• forming an insulating layer covering a first conductive portion of the conductive layer;
• forming a resist layer covering a second conductive portion of the conductive layer, the second conductive portion being left exposed from the insulating layer;
• covering a third conductive portion of the conductive layer with a gold layer, the third conductive portion being exposed from the insulating layer and the resist layer;
• removing the resist layer;
• and
• soldering a first electrode of a semiconductor chip to the third conductive portion after removing the resist layer.