Manufacturing method of semiconductor packaging member, semiconductor packaging member and mounting method thereof

Abstract

The present invention provides a manufacturing method of a semiconductor packaging member, a semiconductor packaging member and a mounting method thereof. The manufacturing method of the semiconductor packaging member includes the following steps of: forming a through hole running through vertically in an outer pin of a lead frame, and disposing a tin block in the through hole; and cutting the lead frame to at least partially expose a side of the tin block located on a cutting surface. Subsequently, when the semiconductor packaging member is soldered on a circuit board, the tin block is melted to realize all-position soldering from a front surface to side surfaces and a back surface, and even the interior of the outer pin, thereby improving the reliability of a circuit, and effectively improving the stability and the pass rate in AOI detection.

Dependencies are inferred from the claim text.