Semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorsYuko NAKAMATA, Takamitsu YOSHIHARA, Yuta TAMAI
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Abstract
A semiconductor device in which delamination between a casing including polyphenylene sulfide with an inorganic filler and a sealing material can be suppressed. A semiconductor device including a casing 16 including an inorganic filler in a matrix including polyphenylene sulfide; a semiconductor element 11 mounted on a laminated substrate 12; and a sealing material 20 sealing the semiconductor element, wherein the inorganic filler is exposed from the matrix on a surface F of the casing 16 facing the sealing material.
Claims12
A semiconductor device comprising:
- a casing comprising an inorganic filler in a matrix comprising polyphenylene sulfide;
- a semiconductor element mounted on a laminated substrate;
- and
- a sealing material sealing the semiconductor element,
- wherein the inorganic filler is exposed from the matrix on a surface of the casing facing the sealing material.
A method for manufacturing a semiconductor device, comprising steps of:
- manufacturing a casing comprising an inorganic filler in a matrix comprising polyphenylene sulfide;
- immersing the casing in an etchant to expose the inorganic filler from the matrix;
- arranging a semiconductor element mounted on a laminated substrate in the casing obtained by the exposing step;
- and
- filling the casing in which the semiconductor element is arranged, with a sealing material for sealing.
Dependencies are inferred from the claim text.