Finfet devices and methods of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Hao Wang, Jui-Chien Huang, Kuo-Cheng Ching, Chun-Hsiung Lin, Pei-Hsun Wang
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Hao Wang, Jui-Chien Huang, Kuo-Cheng Ching, Chun-Hsiung Lin, Pei-Hsun Wang
Estimating the term…
Provided are FinFET devices and methods of forming the same. A FinFET device includes a substrate, a first gate strip and a second gate strip. The substrate has at least one first fin in a first region, at least one second fin in a second region and an isolation layer covering lower portions of the first and second fins. The first fin includes a first material layer and a second material layer over the first material layer, and the interface between the first material layer and the second material layer is uneven. The first gate strip is disposed across the first fin. The second gate strip is disposed across the second fin.
A FinFET device, comprising:
A FinFET device, comprising:
A method of forming a FinFET device, comprising:
Dependencies are inferred from the claim text.