Semiconductor device and manufacturing method thereof
AssigneeNexchip Semiconductor Corporation
InventorsCHIH-NAN WU, WEI PANG CHEN, CHI-CHERNG JENG
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AssigneeNexchip Semiconductor Corporation
InventorsCHIH-NAN WU, WEI PANG CHEN, CHI-CHERNG JENG
Estimating the term…
A semiconductor device and a manufacturing method is provided. The semiconductor device includes a substrate, a shallow trench isolation structure, a dielectric layer, a gate, a source and a drain. The substrate includes a first region and a second region. The shallow trench isolation structure is arranged on the first region and the second region, and the shallow trench isolation structure is lower than a surface of the substrate and forms an opening. The dielectric layer is arranged in the opening and on the substrate, and a height of the dielectric layer in the second region is greater than that in the first region. The gate is arranged on the dielectric layer. The source is arranged on the substrate and located on a side of the gate. The drain is arranged on the substrate and located on the other side of the gate.
A semiconductor device, comprising:
A manufacturing method of a semiconductor device, comprising:
Dependencies are inferred from the claim text.