Semiconductor element memory device

A semiconductor element memory device comprising a plurality of pages disposed in lines, each of the pages being constituted by a plurality of memory cells arranged in columns on a substrate,

• each of the memory cells included in each of the pages comprising:
• a semiconductor body that stands on the substrate in a vertical direction relative to the substrate or that extends along the substrate in a horizontal direction relative to the substrate;
• a first impurity region and a second impurity region that are disposed at respective ends of the semiconductor body;
• a gate insulator layer that is in contact with a side surface of the semiconductor body between the first impurity region and the second impurity region;
• a first gate conductor layer that partially or entirely covers the gate insulator layer;
• and
• a second gate conductor layer that is adjacent to the first gate conductor layer and that is in contact with a side surface of the gate insulator layer, wherein
• in each of the memory cells,
• voltages applied to the first gate conductor layer, the second gate conductor layer, the first impurity region, and the second impurity region are controlled to retain a group of positive holes, generated by an impact ionization phenomenon or a gate-induced drain leakage current, inside the semiconductor body,
• in a page write operation, a voltage of the semiconductor body is made equal to a first data retention voltage that is higher than the voltage of one of the first impurity region or the second impurity region or the voltages of both of the first impurity region and the second impurity region,
• in each of the memory cells that constitute a page among the pages,
• the voltage of the semiconductor body is controlled so as to be higher than the first data retention voltage with one or both of first capacitive coupling between the first gate conductor layer and the semiconductor body and second capacitive coupling between the second gate conductor layer and the semiconductor body, and the group of positive holes are discharged from inside the semiconductor body through one or both of the first impurity region and the second impurity region until the voltage of the semiconductor body becomes equal to a voltage higher than the voltage of one of the first impurity region or the second impurity region or the voltages of both of the first impurity region and the second impurity region,
• in a page erase operation, the voltage of the semiconductor body is made equal to a second data retention voltage lower than the first data retention voltage with the first capacitive coupling and the second capacitive coupling, and
• in the page erase operation, at least two or more pages are simultaneously selected from among the pages and a multi-page erase operation is performed.