Device and method for operating memory in electronic device

An electronic device, comprising:

• a memory configured to include a stack area or a heap area;
• and
• at least one processor configured to perform dynamic memory allocation on the memory and analyze a cause of a memory leak based on stack trace,
• wherein the at least one processor is configured to:
• determine whether a memory leak occurs in one or more low-order stack trace items with a count value of n among collected stack trace items, n being a positive integer;
• and
• based on a low-order stack trace item among the one or more low-order stack trace items being determined as causing the memory leak, proceeding to a next order of the collected stack trace items to thereby determine whether a memory leak occurs in one or more high-order stack trace items with a count value of m which is a positive integer higher than n,
• wherein when m is a maximum count value among the collected stack trace items, memory debugging is performed using a high-order stack trace item, among the one or more high-order stack trace items, causing the memory leak.

An electronic device, comprising:

• a memory leak analysis module configured to determine whether a memory leak occurs in a stack trace item;
• and
• a memory debugger configured to perform memory debugging based on a result of determining whether the memory leak occurs by the memory leak analysis module,
• wherein the memory leak analysis module is configured to:
• determine whether a memory leak occurs in one or more low-order stack trace items with a count value of n among collected stack trace items, n being a positive integer;
• and,
• based on a low-order stack trace item among the one or more low-order stack trace items being determined as causing the memory leak, proceeding to a next order of collected stack trace items to thereby determine whether a memory leak occurs in one or more high-order stack trace items with a count value of m which is a positive integer higher than n,
• wherein when m is a maximum count value among the collected stack trace items, the memory debugger configured to perform memory debugging using a high-order stack trace item, among the one or more high-order stack trace items, causing the memory leak.