Method for manufacturing a set of electronic components on the front of a semiconductor substrate

A method, comprising:

• manufacturing an assembly of electronic components on a front surface of a semiconductor substrate that includes a plurality of field areas, each field area including at least one field and each field including at least one electronic component, the manufacturing including:
• performing a first photolithography step for an opening of contacts of electronic components;
• performing a second plurality of photolithography steps forming a stack of layers forming each electronic component, each second photolithography step defining a mask level and applying a mask successively on each field in photolithography equipment, a positioning of the mask on each field being performed relative to a reference mask level, one of the masks being an identification mask, the performing including:
• applying the mask that corresponds to identification mask at the first photolithography step for the opening of contacts;
• at the first photolithography step for the opening of contacts, defining a mask level that corresponds to the identification mask, positioning the identification mask with a predetermined offset with respect to the reference mask level, the offset being different for each field area, the electronic component(s) of a field area exhibit an identification element appearing as the predetermined offset between a pattern defined at the reference mask level and a pattern defined at the identification mask level.