Resampling with TDI Sensors

A method for inspecting electrical circuits, the method comprising:

• providing a scanner including at least one multiline Time Delay Integration (TDI) sensor having multiple parallel lines of sensor pixels, each of said parallel lines extending along a line axis, said multiple lines of sensor pixels being separated from each other by a separation distance along a scanning axis that is perpendicular to said line axis, each of said sensor pixels having a sensor pixel dimension along said scanning axis;
• defining a mutual displacement distance of said multiline TDI sensor and an electrical circuit to be inspected along said scanning axis during acquisition of each of said multiple lines of said multiline TDI sensor;
• mutually displacing, by said mutual displacement distance, said multiline TDI sensor and said electrical circuit to be inspected along said scanning axis;
• directing, using scanning optics, light reflected from said electrical circuit to said sensor pixels, said scanning optics defining a projection of each of said sensor pixels onto said electrical circuit, wherein said projection defines the area on the electrical circuit from which light reaches each of said sensor pixels, said projection having a sensor pixel projection dimension along said scanning axis, said mutual displacement distance being greater than said sensor pixel projection dimension along said scanning axis, and
• constructing an image from composite output pixels of the multiline TDI sensor, said image comprising a plurality of said composite output pixels, each of said composite output pixels having a composite image collection profile along said scanning axis, said composite image collection profile having a composite image collection profile dimension along said scanning axis which is greater than said sensor pixel projection dimension.