Process kit de-bubbling
AssigneeLam Research Corporation
InventorsJames Isaac Fortner, Steven T. Mayer, Stephen J. Banik
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Abstract
In some examples, an electroplating apparatus is provided for depositing a metal layer on a substrate. An example electroplating apparatus comprises a plating cell to receive a plating solution, an electrode, a counter electrode, a substrate holding fixture, a resistive element, and a de-bubbler device supportable rotatably adjacent the resistive element to generate or direct a flow of plating solution through the resistive element to release trapped bubbles.
Claims21
An electroplating apparatus for depositing a metal layer on a substrate, the electroplating apparatus comprising:
- a plating cell to receive a plating solution;
- an electrode;
- a counter electrode;
- a substrate holding fixture;
- a resistive element;
- and
- a de-bubbler device supportable rotatably adjacent the resistive element to generate or direct a flow of plating solution through the resistive element.
A method of de-bubbling electroplating apparatus for depositing a metal layer on a substrate, the electroplating apparatus including a plating cell, a substrate holding fixture, a resistive element, and a de-bubbler device, the method comprising:
- introducing plating solution into the plating cell;
- supporting a substrate in the substrate holding fixture;
- depositing a metal layer on the substrate using the resistive element;
- and
- generating an upward flow of plating solution through the resistive element using the de-bubbler device to release bubbles trapped under the resistive element.
A de-bubbler device for de-bubbling electroplating apparatus, the de-bubbler device comprising:
- a back plate, and
- at least one flow generation element, or
- at least one flow control element.
A de-bubbler device for de-bubbling electroplating apparatus, the de-bubbler device comprising:
- a back plate, the back plate having a wafer-shaped configuration enabling the de-bubbler device to be mounted in a substrate support fixture of the electroplating apparatus;
- an arrangement of flow generation elements including a plurality of linear ribs arranged in a cross-hatch pattern, each linear rib extending between peripheral locations of the back plate and standing proud of an underside of the back plate, the cross-hatch pattern of linear ribs including a plurality of rib joinder points and a plurality of rectilinear recesses disposed between adjacent ribs;
- and
- a plurality of flow elements, each flow control element including a linear baffle extending between peripheral locations of the back plate, the linear baffle configured to lie adjacent an opposed flow control element of a resistive element in a clocked position of the de-bubbler device in an electroplating apparatus.
Dependencies are inferred from the claim text.