Apparatus for manufacturing copper foil

An apparatus for manufacturing a copper foil, comprising:

• an electrodeposition unit configured to electrodeposit a copper foil in an electroplating method using an electrolyte;
• and
• a winding unit configured to wind the copper foil supplied from the electrodeposition unit,
• wherein the electrodeposition unit includes a negative electrode drum on which the electrodeposited copper foil is electrodeposited in the electroplating method using the electrolyte and a positive electrode unit electrically connected with the negative electrode drum through the electrolyte,
• the positive electrode unit includes a positive electrode body spaced apart from the negative electrode drum, a plurality of positive electrode plates disposed on an upper surface of the positive electrode body, and a plurality of fastening units fastening each of the positive electrode plates to the positive electrode body,
• a first positive electrode plate among the positive electrode plates is coupled to the positive electrode body by a first fastening member among the fastening units,
• a second positive electrode plate among the positive electrode plates is coupled to the positive electrode body by a second fastening member among the fastening units, and
• the second positive electrode plate includes a second covering member disposed on an upper surface of the first positive electrode plate to cover the first fastening member and a second coupling member into which the second fastening member is inserted.