Process kits and related methods for processing chambers to facilitate deposition process adjustability

A processing chamber applicable for use in semiconductor manufacturing, comprising:

• an internal volume;
• a plurality of lamps;
• a substrate support disposed in the internal volume, the substrate support comprising a support face;
• a window at least partially defining the internal volume, the window comprising:
• a first face that is concave or flat, and
• a second face that is convex, the second face facing the substrate support.

A method of processing substrates, comprising:

• heating a substrate positioned on a substrate support in a processing volume of a chamber;
• flowing one or more process gases over the substrate to form one or more layers on the substrate, the flowing of the one or more process gases over the substrate comprising guiding the one or more process gases between a plate and the substrate, the plate supported on a liner to divide the processing volume into a lower portion and an upper portion;
• exhausting the one or more process gases;
• flowing one or more cleaning gases through the upper portion while the plate is supported on the liner, the upper portion being between the plate and a window;
• and
• exhausting the one or more cleaning gases.