An atomic layer deposition apparatus and a method

An atomic layer deposition apparatus for processing a surface of a substrate successively with at least a first precursor and a second precursor, the apparatus comprising:

• a substrate support having a support surface and arranged to support one or more substrates;
• a precursor supply head having an output face via which precursors are supplied;
• the support surface of the substrate support and the output face of the precursor supply head being arranged opposite to each other such that a reaction gap is provided between the support surface of the substrate support and the output face of the precursor supply head;
• and
• a moving mechanism, the substrate support and the precursor supply head are arranged to be rotated relative to each other with the moving mechanism such that the support surface of the substrate support and the output face of the precursor supply head are arranged to be rotated relative to each other,
• wherein the moving mechanism is further arranged to move the substrate support and the precursor supply head relative to each other in a moving direction extending between the support surface of the substrate support and the output face of the precursor supply head such that the reaction gap is adjusted.

A method for operating an atomic layer deposition apparatus, the apparatus comprising:

• a substrate support having a support surface and arranged to support one or more substrates;
• a precursor supply head having an output face via which precursors are supplied;
• and
• the support surface of the substrate support and the output face of the precursor supply head being arranged opposite to each other such that a reaction gap is provided between the support surface of the substrate support and the output face of the precursor supply head, the method comprising:
• rotating the substrate support and the precursor supply head relative to each other with the moving mechanism during processing the one or more substrates such that the support surface of the substrate support and the output face of the precursor supply head are arranged to be rotated relative to each other, and
• moving the substrate support and the precursor supply head relative to each other in a moving direction extending between the support surface of the substrate support and the output face of the precursor supply head such that the reaction gap is adjusted for adjusting reaction gap.