Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

A method of manufacturing a semiconductor device, comprising:

• forming a film on at least one substrate by performing a cycle a predetermined number of times, the cycle including:
• a first act that includes supplying a precursor to the at least one substrate from at least one first ejecting hole of a first nozzle arranged along a substrate arrangement direction of a substrate arrangement region where the at least one substrate is arranged;
• and
• a second act that includes supplying the precursor to the at least one substrate from at least one second ejecting hole of a second nozzle arranged along the substrate arrangement direction of the substrate arrangement region,
• wherein one of the at least one first ejecting hole and the at least one second ejecting hole is configured such that an amount of adsorption of a main element contained in the precursor on a surface of the at least one substrate increases from one end toward the other end of the substrate arrangement region in the substrate arrangement direction, and
• wherein the other one of the at least one first ejecting hole and the at least one second ejecting hole, which is different from the one of the at least one first ejecting hole and the at least one second ejecting hole, is configured such that the amount of adsorption of the main element contained in the precursor on the surface of the at least one substrate decreases from the one end toward the other end of the substrate arrangement region in the substrate arrangement direction.