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US 2023/0407440 A1Published application
Aluminum alloy extruded material and electronic device housing comprising same
AssigneeSamsung Electronics Co., Ltd.
InventorsJinhwan JEONG, Jungwoo CHOI, Sungho CHO, Seungchang BAEK, Yoonhee LEE, Byounguk YOON
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Abstract
An aluminum alloy extruded material and an electronic device housing including the same are provided. The aluminum alloy extruded material includes aluminum, zinc, magnesium, and copper, and the amount of copper and the amount of zinc have a correlation.
Claims14
An aluminum alloy extruded material comprising:
- aluminum (Al);
- zinc (Zn);
- magnesium (Mg);
- and
- copper (Cu),
- wherein an amount of copper (Cu) and an amount of zinc (Zn) satisfy Equation 1 below,
- [Cu]≥0.14[Zn]−0.782, and
- wherein [Cu] corresponds to an amount (% by weight (wt %)) of copper (Cu), and [Zn] corresponds to an amount (wt %) of zinc (Zn).
5 more elements
Dependencies are inferred from the claim text.