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US 2023/0407424 A1Published application
Vacuum heat treatment apparatus
AssigneeTokyo Electron Limited
InventorJunichi TAKEI
Life of this patent
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Abstract
There is a vacuum heat treatment apparatus comprising: a vacuum chamber; a stage disposed in the vacuum chamber and having a substrate placing surface on which a substrate is placed; a heater provided in the stage; a partition member configured to partition a part of an internal space of the vacuum chamber to form a gas processing space between itself and the substrate placing surface of the stage; and a gas supply configured to supply gas to the gas processing space.
Claims12
A vacuum heat treatment apparatus comprising:
- a vacuum chamber;
- a stage disposed in the vacuum chamber and having a substrate placing surface on which a substrate is placed;
- a heater provided in the stage;
- a partition member configured to partition a part of an internal space of the vacuum chamber to form a gas processing space between itself and the substrate placing surface of the stage;
- and
- a gas supply configured to supply gas to the gas processing space.
3 more elements
Dependencies are inferred from the claim text.