One component (1k) curable adhesive composition
AssigneeHenkel AG & Co. KGaA
InventorsStefanie Stapf, Uta Sundermeier, Benjamin Brunstedt, Thomas Kamm
Life of this patent
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Abstract
The present invention is directed to a curable and electrochemically debondable one-component (1K) adhesive composition comprising, based on the weight of the composition: from 40 to 90 wt. % of i) at least one ethylenically unsaturated non-ionic monomer; from 1 to 30 wt. % of ii) non-polymerizable electrolyte; from 0.1 to 10 wt. % of iii) at least one radical generating thermal initiator; from 0 to 20 wt. % of iv) filler; and, from 0 to 20 wt. % of v) toughener.
Claims14
A curable and electrochemically debondable one-component (1K) adhesive composition comprising, based on the weight of the composition:
- from 40 to 90 wt % of i) at least one ethylenically unsaturated non-ionic monomer;
- from 0.1 to 30 wt. % of ii) non-polymerizable electrolyte;
- from 0.1 to 10 wt. % of iii) at least one radical generating thermal initiator;
- from 0 to 20 wt. % of iv) filler;
- and,
- from 0 to 20 wt. % of v) toughener.
Dependencies are inferred from the claim text.