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US 2023/0407093 A1Published application
Low-shear viscosity reducing additive
AssigneesDow Silicones Corporation, Dow Global Tecjnologies LLC
InventorsDan Zhao, Shane Mangold, Richard Cooper, Dongchan Ahn, Kyle McDonald, Joseph Sootsman, Darren Hansen
Life of this patent
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Abstract
A composition contains: (a) a first polyorganosiloxane; (b) 50-80 volume percent, based on composition volume, of conductive fillers; and (c) 0.1 to 2.0 weight-percent, based on composition weight, of a second polyorganosiloxane different from the first polyorganosiloxane, the second polyorganosiloxane having an average of 0.5 to 1.5 anhydride groups per molecule.
Claims10
A composition comprising:
- a. a first polyorganosiloxane;
- b. 50-80 volume-percent, based on composition volume, of conductive fillers;
- and
- c. 0.1 to 2.0 weight-percent, based on composition weight, of a second polyorganosiloxane different from the first polyorganosiloxane, the second polyorganosiloxane having an average of 0.5 to 1.5 anhydride groups per molecule;
- where the first polyorganosiloxane has a lower dynamic viscosity than the second polyorganosiloxane.
2 more elements
(canceled)
Dependencies are inferred from the claim text.