Photosensitive polyimide resin composition, resin film, and electronic device

A photosensitive polyimide resin composition comprising:

• a ring-closed polyimide resin (A) having a structure represented by Formula (1);
• and
• a polyfunctional radically polymerizable compound (B) having radically polymerizable functional groups and oxyalkylene groups,
• wherein a number of the radically polymerizable functional groups in the polyfunctional radically polymerizable compound (B) is 3 or greater and 100 or less, and
• wherein a total number of moles of the oxyalkylene groups added in the polyfunctional radically polymerizable compound (B) is 5 or greater and 100 or less:
• where R is a tetravalent group with 4 or more and 10 or less carbons, having a cyclic structure, an acyclic structure, or a cyclic structure and an acyclic structure;
• A has at least one group selected from the group consisting of an aliphatic hydrocarbon group, an alicyclic hydrocarbon group, an aromatic hydrocarbon group, and an organosiloxane group, and is a divalent group with 2 or more and 39 or less carbons;
• on a main chain of A, at least one intervening group selected from the group consisting of —O—, —SO2—, —CO—, —CH2—, —C(CH3)2—, —C2H4O—, and —S— may be present;
• n represents a number of repeating units;
• terminal ends of Formula (1) are each selected from the group consisting of a group represented by Formula (2), a group represented by Formula (3), and a hydrogen atom, and at least one of the terminal ends is a group represented by Formula (2) or (3),
• where X and X2 are each independently a group with 2 or more and 15 or less carbons, and may have at least one group selected from the group consisting of ester bonds and double bonds;
• and Y and Y2 are each independently a hydrogen atom or a methyl group.