Rubber resin material with high thermal conductivity and low dielectric properties and metal substrate using the same

Abstract

A rubber resin material with high thermal conductivity and low dielectric properties and a metal substrate using the same are provided. The rubber resin material includes a rubber resin composition and at least one surface-modified inorganic filler. The rubber resin composition includes 30 wt % to 60 wt % of a liquid rubber, 10 wt % to 40 wt % of a polyphenylene ether resin, and 10 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 2500 g/mol to 6000 g/mol. The at least one surface-modified inorganic filler has one or more modifying functional groups that are selected from the group consisting of an acrylic group, a functional group having a nitrogen-containing main or branched chain, a double bond-containing functional group, and an epoxy group.

Dependencies are inferred from the claim text.