Heat-curable resin composition

Abstract

Provided is a heat-curable resin composition capable of lowering the elastic modulus of a cured product obtained even when a heat-curable resin component in the composition contains an organic solvent or has a high curing temperature. The heat-curable resin composition contains: (A) a heat-curable resin; and (B) spherical polymethylphenyl silsesquioxane particles that have a volume average particle size of 0.1 to 30 μm, and are in an amount of 1 to 35 parts by mass per 100 parts by mass of the component (A), wherein a molar ratio between units represented by CH3SiO3/2 and units represented by C6H5SiO3/2 (CH3SiO3/2 units:C6H5SiO3/2 units) in the polymethylphenyl silsesquioxane particles is 95:5 to 55:45.

Dependencies are inferred from the claim text.