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US 2023/0407071 A1Published application
Polymeric substrate including a barrier layer
AssigneeINV Polypropylene, LLC
InventorsBilly R. Bodiford, Ross Michael Mahan
Life of this patent
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Abstract
A polymeric substrate is disclosed. The polymeric substrate comprises a barrier layer including a polymeric material comprising about 50 wt. % or more of at least one polyolefin polymer and 50 wt. % or less of a hydrocarbon resin. The polymeric material exhibits a DTUL of 30° C. or more and a tensile modulus of 500 MPa or more and/or a flexural secant modulus of 500 MPa or more. The barrier layer has a thickness of greater than 200 μm to 6,500 μm. A shaped polymeric article comprising the polymeric substrate is also disclosed.
Claims21
1-62. (canceled)
A barrier layer comprising:
- a polymeric material comprising about 50 wt. % or more to about 95 wt. % or less of at least one polyolefin polymer and about 5 wt. % or more to about 50 wt. % or less of a hydrocarbon resin,
- wherein the polymeric material exhibits a DTUL of 30° C. or more and/or a flexural secant modulus of 500 MPa or more.
A barrier layer comprising:
- a polymeric material comprising at least one polyolefin polymer a hydrocarbon resin,
- wherein the barrier layer has a thickness of greater than 200 μm to 6,500 μm, and
- wherein the barrier layer has a water vapor transmission rate of 3.0 cm3/m2/day or less and/or an oxygen transmission rate of 60 cm3/100 in2/day or less.
Dependencies are inferred from the claim text.