Microelectromechanical element and a method for manufacturing it
AssigneeMurata Manufacturing Co., Ltd.
InventorsAltti TORKKELI, Jussi OKSANEN, Aarni HÄRKÖNEN, Juha LAHDENPERÄ
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Abstract
A microelectromechanical element is provided with patterned regions of wafer material and glass material. The regions of glass material include at least a first glass region and a second glass region formed of a first glass material and a second glass material, respectively. The first glass material enables anodic bonding with the wafer material. An alkali metal content of the second glass material is less than an alkali metal content of the first glass material.
Claims20
A microelectromechanical element comprising:
- a plurality of microstructures of wafers bonded to each other, such that a gap is closed by bonding of the microstructures;
- mobile structure parts suspended to move within the closed gap;
- at least one internal electrode arranged in the gap and configured to detect or actuate movement of the mobile structure parts;
- and
- patterned regions of wafer material and glass material, the regions of glass material including at least a first glass region comprising a first glass material and a second glass region comprising a second glass material,
- wherein the first glass material enables anodic bonding with the wafer material, and
- wherein the second glass material has an alkali metal content that is less than an alkali metal content of the first glass material.
A method for manufacturing a microelectromechanical element of wafers bonded to each other, the method comprising:
- forming a plurality of microstructures, which include first and second microstructures, by patterning into a first wafer for each of the first microstructures a recess and mobile structure parts that are suspended to move within the recess;
- forming into at least one of the first and second microstructures at least one internal electrode arranged to detect or actuate movement of the mobile structure parts;
- forming into at least one of the first and the second microstructures a first glass region of a first glass material configured to be anodically bonded to a wafer material of the first wafer or a second wafer;
- forming into at least one of the first and the second microstructure a second glass region of a second glass material, wherein the second glass material has an alkali metal content that is less than the alkali metal content of the first glass material;
- permanently fixing the first wafer and the second wafer by anodically bonding the first glass regions to the wafer material of the first wafer or of the second wafer;
- and
- dicing the microelectromechanical element from the anodically bonded first and second wafers.
Dependencies are inferred from the claim text.