Glass dielectric layer with patterning
AssigneeIntel Corporation
InventorsJieying KONG, Gang DUAN, Srinivas PIETAMBARAM, Patrick QUACH, Dilan SENEVIRATNE
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AssigneeIntel Corporation
InventorsJieying KONG, Gang DUAN, Srinivas PIETAMBARAM, Patrick QUACH, Dilan SENEVIRATNE
Estimating the term…
Embodiments of the present disclosure may generally relate to systems, apparatus, and/or processes directed to a manufacturing process flow for packages that include one or more glass layers that include patterning features, such as electrically conductive traces, RDLs, and vias within the packages. In embodiments, a package may include a glass layer with a first side and a second side opposite the first side, where the glass layer is a dielectric layer. The package may include another layer coupled with the first side of the glass layer, and a pattern on the second side of the glass layer to receive a deposited material in at least a portion of the pattern.
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Dependencies are inferred from the claim text.