Methods and apparatuses for altering portions of substrates with vibration energy

A method of altering a portion of the substrate comprising:

• providing a first device comprising an outer surface;
• providing a second device comprising a source of vibration energy;
• forming a nip between the source of vibration energy and the outer surface;
• applying thermal energy to a portion of the substrate upstream of the nip to raise a temperature of the portion of the substrate to a temperature below a melting temperature of the portion of the substrate, wherein the temperature below the melting temperature of the portion of the substrate is in the range of about 90 degrees C. to about 160 degrees C.;
• conveying the substrate through the nip;
• and
• applying vibration energy from the source of vibration energy to the substrate in the nip to alter the portion of the substrate.

A method of altering a portion of a substrate comprising:

• providing a first device comprising an outer surface;
• providing a second device comprising a source of vibration energy;
• forming a nip between the source of vibration energy and the outer surface;
• conveying the substrate into contact with a substrate spreader upstream of the nip to mitigate fold over or wrinkles in the substrate;
• conveying the substrate through the nip;
• and
• applying vibration energy from the source of vibration energy to the substrate in the nip to alter the portion of the substrate.