Polishing device and polishing method

A polishing device that polishes a workpiece, the polishing device comprising:

• a plurality of workpiece holding units that respectively hold the workpieces;
• a base part that is rotatable about a center axis, and is arranged such that the plurality of workpiece holding units are arranged mutually at an equal interval on an identical circumference at an arbitrary distance from the center axis;
• and
• a plurality of workpiece polishing units that polish polishing target surfaces of the workpieces held by the workpiece holding units,
• wherein the plurality of workpiece polishing units are provided above the base part and at a plurality of polishing positions for polishing the workpieces, and are not provided at a workpiece exchange position for exchanging the polished workpieces held by the workpiece holding units,
• the plurality of polishing positions and the workpiece exchange position are provided on an identical circumference about the center axis of the base part, and
• the base part rotates in one direction about the center axis to sequentially move the workpiece holding units that hold the workpieces to the plurality of polishing positions such that the plurality of workpiece polishing units polish the workpieces, and moves the workpieces polished by the plurality of workpiece polishing units to the workpiece exchange position, and exchanges the polished workpieces with a workpiece that is not yet polished.