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US 2023/0405645 A1Published application
Method for treating a substrate
AssigneeSemes Co., Ltd.
InventorsKyeong Min LEE, Tae-Keun KIM, Min Hee CHO, Won Young KANG
Life of this patent
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Abstract
The inventive concept provides a substrate treating method. The substrate treating method includes supplying a dissolving solution onto a rotating substrate; and supplying, after the supplying a dissolution solution, a treating liquid including a polymer onto the rotating substrate to form a liquid film.
Claims23
A substrate treating method comprising:
- supplying a dissolution solution onto a rotating substrate;
- and
- supplying, after the supplying a dissolution solution, a treating liquid including a polymer onto the rotating substrate to form a liquid film,
- wherein the dissolution solution is provided at a boiling temperature of the dissolution solution.
1 more element
(canceled)
(canceled)
A substrate treating method comprising:
- supplying a dissolution solution onto a rotating substrate;
- and
- supplying a treating liquid including a polymer onto the rotating substrate,
- wherein the dissolution solution includes an organic solvent, and
- wherein the dissolution solution is provided at a boiling temperature of the dissolution solution.
2 more elements
(canceled)
A substrate treating method comprising:
- supplying a dissolution solution onto a rotating substrate;
- supplying a treating liquid including a polymer onto the rotating substrate to form a liquid film of the treating liquid;
- solidifying the liquid film by stopping the supplying a treating liquid while keeping the rotation of the substrate;
- supplying a peeling liquid on the rotating substrate to peel the solidified liquid film from the substrate;
- supplying a rinsing liquid onto the rotating substrate to clean a residue on the substrate;
- and
- drying the substrate by stopping the supplying a rinsing liquid while keeping the rotation of the substrate,
- wherein the polymer includes a resin and the solution is an organic solvent, and
- wherein the dissolution solution is provided at a boiling temperature of the dissolution solution or lower.
6 more elements
Dependencies are inferred from the claim text.