Method for fixing electronic component pin

Abstract

A method for fixing an electronic component pin is provided, and relates to the technical field of printed circuit board assembly (PCBA), for improving the soldering effect of the electronic component in being soldered. The method includes performing bending treatment on a pin of an electronic component; performing stress relieving forming to the pin after being subjected to the bending treatment; placing the electronic component after being subjected to the stress relieving forming in a height-controlling support jig, where the distance between the electronic component and a circuit board is defined by the height-controlling support jig; mounting the height-controlling support jig, in which the electronic component is placed, in a corresponding position of the electronic component on the circuit board; and soldering the electronic component onto the circuit board.

Dependencies are inferred from the claim text.