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US 2023/0403789 A1Published application
Wiring substrate
AssigneeIbiden Co., Ltd.
InventorsHiroki WAKAMORI, Ikuya TERAUCHI, Takahiro YAMADA
Life of this patent
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Abstract
A wiring substrate includes an insulating layer, and a conductor layer including a wiring formed on the insulating layer. The wiring in the conductor layer has a first section and a second section formed such that a wiring width in the second section is smaller than a wiring width in the first section and that a wiring thickness in the second section is larger than a wiring thickness in the first section.
Claims20
A wiring substrate, comprising:
- an insulating layer;
- and
- a conductor layer including a wiring formed on the insulating layer,
- wherein the wiring in the conductor layer has a first section and a second section formed such that a wiring width in the second section is smaller than a wiring width in the first section and that a wiring thickness in the second section is larger than a wiring thickness in the first section.
1 more element
Dependencies are inferred from the claim text.