Package structure and manufacturing method thereof

A manufacturing method of a package structure, comprising:

• providing a wafer bump of an ASIC assembly wafer and singulating the wafer bump of the ASIC assembly wafer into an individual ASIC assembly;
• manufacturing an organic interposer using a temporary glass carrier and singulating the organic interposer into an individual organic interposer;
• providing a wafer bump of an EIC assembly wafer and a wafer bump of a PIC assembly wafer and singulating the wafer bump of the EIC assembly wafer and the wafer bump of the PIC assembly wafer into an individual EIC assembly and an individual PIC assembly;
• attaching the individual EIC assembly or the individual PIC assembly on the individual organic interposer carrying the temporary glass carrier;
• removing the temporary glass carrier and attaching the individual EIC assembly or the individual PIC assembly to a bottom of the organic interposer, and then electroplating a copper pillar and a solder cap;
• connecting a three-dimensional stack of the ASIC assembly and the EIC assembly or the PIC assembly on a package substrate with/without an accommodating groove, and then connecting the package substrate on a circuit board using a solder ball;
• and
• applying a thermal management system on the ASIC assembly and the EIC assembly or the PIC assembly.